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                                            當前所在位置:首頁 > 產品中心 > IC半導體芯片測試

                                            WLCSP Probe Head

                                            產品簡述 PRODUCT DESCRIPTION

                                            特點:

                                            -適用于0.35 pitch以上晶圓級封裝芯片/ Applied in WLCSP package with 0.35 above
                                            -支持射頻性能測試/ support RF performance testing
                                            -支持-40~125°C高低溫測試/support high&low temp(-40~125°C) testing
                                            -支持多site測試&direct docking,易安裝維護/ support multi-site testing&direct docking, easier installation and maintenance.






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